¢Æ¢Æ SPEEDFAM CO., LTD. ¢Æ¢Æ
   
 
   
 
 
 
 
 
 
 
 
   
 
 
 
CompolÀº »çÆÄÀ̾î, LiTaO3/LiNbO3, Ceramic, °¢Á¾ ±Ý¼ÓÁ¾·ùÀÇ Polishing¿¡ Àû¿ëµÇ´Â Á¦Ç°À¸·Î
°í¼øµµ Colloidal Silica ÀÔ´Ï´Ù.
CompolÀº ÀÌÀü °øÁ¤ÀÇ °¡°ø¿¡¼­ »ý±ä ¿¬¸¶Àç ÀÚ±¹ ¹× ÀÛÀº Scratch¸¦ °¨¼Ò ½ÃÄÑ Ç¥¸éÀÇ Á¶µµ¸¦
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  20 50 80 120 EX II
SiO2 content (%) 40 40 40 40 29
PH 9.1 10.0 10.2 9.4 9.8
Specific Gravity 1.29 1.29 1.29 1.29 1.20
Average particle size (nm) 10~20 30~50 62~82 70~95 43~59
Standard packing 20kg cubitainer
Applications : sapphire, CaF©ü, BGO, LiTaO©ý, LiNbO©ýand other oxide crystals
 
  50S 50AD
SiO2 content (%) 49 49
PH 10.9 11.3
Specific Gravity 1.38 1.38
Average particle size (nm) 25 ~ 45 20 ~ 40
Polishing rate (§­/min) 0.6 ~ 1.0 0.7 ~ 1.1
Standard packing 20kg cubitainer
Applications : first and second polishing of Si wafer
 
 
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GaAS,GaP,IN-P°°Àº ´Ù¾ÓÇÑ Á¦Ç°ÀÇ ¼øÂ÷ÀûÀÎ PolishingÀÌ °¡´ÉÇϸç
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°ú¸³»óÅ·ΠµÇ¾î ÀÖÀ¸¸ç »ç¿ë Á÷Àü ³ì¿©¼­ »ç¿ëÇØ¾ß ÇÕ´Ï´Ù.
 
 
 
POLIPLA´Â ÇÁ¶ó½ºÆ½ ·»Áî¿ëÀ¸·Î °³¹ßÇÑ Compound typeÀÇ Á¦Ç°ÀÔ´Ï´Ù.
±ÕÀÏÇÏ°Ô ºÐ»ê½ÃŲ °í¼øµµ Alumina¿Í PH°¡ ¾à 3~4ÀÇ Æ¯¼ö Á¶¼º¾×À¸·Î ¸¸µé¾î Á³½À´Ï´Ù.
³ôÀº °¡°ø·Â°ú Ç¥¸é Á¶µµ¸¦ ¾òÀ» ¼ö ÀÖÀ¸¸ç, »ç¿ë¸ñÀû¿¡ µû¶ó ´Ù¾çÇÑ Á¾·ùÀÇ Á¦Ç°À» ¼±Åà °¡´ÉÇÕ´Ï´Ù.
 
TYPE 103A 107A 103H 207A 203H
PH 3.7 3.7 3.7 3.4 3.4
Average partice size (D50, §­) 1.3 1.3 0.8 1.3 0.8
Specific gravity 1.155 1.160 1.145 1.165 1.162
Polishing rate (g/5min) 0.09 0.09 0.05 0.10 0.06
¡Ø Surface roughness [Ra] (nm) 3.3 3.3 2.2 3.0 2.1
¡Ø Standard packaging : 1 U.S. Gallon plastic coutainer